In 2025, the Apple plans to introduce a slimmer version of the iPhone that will be sold alongside the iPhone 17, the iPhone 17 Pro and the iPhone 17 Pro Max.
The iPhone 17 Air, as it is said to be called, will be about two millimeters thinner than the current one. iPhone 16 Pro, according to Bloomberg’s Mark Gurman.
The iPhone 16 Pro is 8.25mm thick, so an iPhone 17 that is 2mm thinner comes in at around 6.25mm. At 6.25mm, the iPhone 17‌ Air would be Apple’s thinnest iPhone to date. The thinnest iPhone we’ve seen so far was the iPhone 6, which measured 6.9mm iPhones got thicker with the iPhone X and beyond, as Apple increased the thickness to provide more space for battery, camera lens, Face ID hardware and more. .
Apple will equip the iPhone 17‌ Air with its own specially designed modem chip 5G and this chip is smaller than Qualcomm’s 5G modem chips. Gurman says that Apple focused on making the chip more integrated with other Apple-designed components to save space in the iPhone, and that the spare space is what made it possible to create the thinner iPhone 17‌ Air without sacrificing the battery life, camera or display quality.
Previous rumors have also suggested that the iPhone 17‌ Air will be somewhere between 5mm thick. and 6 mm., and the thickness of about 6 mm. it has now been reported by several reliable sources. The iPhone 17 Air is expected to have a screen size of around 6.6 inches and also have a rear camera with a single lens.
The iPhone 17‌ Air will be one of three devices set to get a custom Apple modem chip in 2025, with Apple also bringing the chip to iPhone SE at the beginning of the year and a low-cost iPad.
As Apple refines the design of its modem chip, the space saved could enable “new designs,” such as a foldable iPhone. According to Gurman, Apple continues to explore the technology to produce a foldable iPhone. Apple aims to phase out Qualcomm modems over a three-year period as Apple introduces increasingly powerful modem chips.
Eventually, Apple could introduce a system-on-a-chip that includes a processor, modem, Wi-Fi chip and other components, which save additional space and allow for closer integration between hardware components.